Thermal Grizzly - cutting edge thermal compound products from Germany!

"Thermal compound products are the weakest link in transferring heat between component and heat sink. Our goal is to eliminate this weak point. We had the idea to do this by using high performance thermal compound products for several years now", says Eike Salow, computer scientist and founder of Thermal Grizzly.
"We know about the very high expectations of the evergrowing overclocker scene regarding high performance cooling solutions - and we strive to exceed them. To emphasize this claim, we worked closely with extreme overclocker Roman "der8auer" Hartung during development."
Read more: Thermal Grizzly - cutting edge thermal compound products from Germany!
Conductonaut

Our Conductonaut liquid metal thermal compound is designed for applications that require very high efficiency. Conductonaut is recommended for experienced users who are looking for a top performance product with best heat dissipation where temperature ranges are above 8 °C.
- Ultra high thermal conductivity
- Increased indium content
- Easy application with synthetic needle
Application | Rating |
---|---|
Thermal Conductivity | ******* |
Sub-Zero Overclocking | * |
Overclocking | ***** |
Water Cooling | ***** |
Air Cooling | ***** |
Silicone Sensitive Areas | — |
Kryonaut Extreme

Thermal Grizzly Kryonaut Extreme is based on our well known Kryonaut paste. For Kryonaut Extreme the maximum thermal conductivity was accomplished due to the smallest particle size, thinner minimum layer height and improved low temperature application.
- designed for Overclocking
- 14,2 W/m*K thermal conductivity
- no curing
- long-term durability
Application | Rating |
---|---|
Thermal Conductivity | ***** |
Sub-Zero Overclocking | ***** |
Overclocking | ***** |
Water Cooling | ***** |
Air Cooling | ***** |
Silicone Sensitive Areas | — |
Kryonaut

Kryonaut thermal grease was created especially for the extremely demanding applications and the highest expectations of the overclocking community. Kryonaut is also highly recommended as a top product for critical cooling systems in the industrial environment.
- designed for Overclocking
- excellent thermal conductivity
- no curing
- long-term durability
- no electrical conductivity!!!
- applicable with aluminum (warning is for Conductonaut only!)
Application | Rating |
---|---|
Thermal Conductivity | ***** |
Sub-Zero Overclocking | ***** |
Overclocking | ***** |
Water Cooling | ***** |
Air Cooling | ***** |
Silicone Sensitive Areas | — |
Hydronaut

Hydronaut can be used for overclocking due to it's excellent thermal conductivity, but it was created specifically for users with larger-scale cooling solutions, who are looking for a quality product with an excellent price-performance ratio, for example for their water cooling system.
- suited for Overclocking
- excellent thermal conductivity
- no curing
- silicone-free
- no electrical conductivity
- applicable with aluminum (warning is for Conductonaut only!)
Application | Rating |
---|---|
Thermal Conductivity | **** |
Sub-Zero Overclocking | **** |
Overclocking | ***** |
Water Cooling | ***** |
Air Cooling | ***** |
Silicone Sensitive Areas | ***** |
Aeronaut

Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.
- very good thermal conductivity
- long-term durability
- no curing
- no electrical conductivity
- applicable with aluminum (warning is for Conductonaut only!)
Application | Rating |
---|---|
Thermal Conductivity | *** |
Sub-Zero Overclocking | * |
Overclocking | ** |
Water Cooling | **** |
Air Cooling | **** |
Silicone Sensitive Areas | — |
Carbonaut

Thermal Grizzly Carbonaut high-tech carbon thermal pads can be used as an excellent alternative to mid-range thermal compounds. They have the exclusive advantage of being reusable, with a very elastic and adaptable surface and very high thermal conductivity. Even the slightest unevenness can be compensated very well.
- Maximum thermal conductivity
- Constantly high performance
- Reusable
- Does not dry out
- Flexible and easy to use
Application | Rating |
---|---|
Thermal Conductivity | **** |
Sub-Zero Overclocking | ** |
Overclocking | *** |
Water Cooling | **** |
Air Cooling | ***** |
Silicone Sensitive Areas | ***** |
Minus Pad 8

The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses.
- High thermal conductivity
- High compressibility
- Electrical insulation
Application | Rating |
---|---|
Thermal Conductivity* |
**** |
Sub-Zero Overclocking | * |
Overclocking | *** |
Water Cooling | **** |
Air Cooling | **** |
Silicone Sensitive Areas | — |
*within the Capabilities of Thermal Pads
M.2 SSD Cooler

The Thermal Grizzly M.2 SSD Cooler is a passive cooling solution for next generation form factor SSDs. It's no secret that modern M.2 NVMe SSDs, in particular, get hot when in demanding use, so the speed of the drive has to be slowed down. To counteract this problem and get full performance, the Grizzly professionals have developed a compact passive cooler that significantly reduces the temperatures of an M.2 SSD.
The Thermal Grizzly M.2 SSD Cooler at a glance
- Black Passive Cooler for M.2 SSDs
- lower temperatures to reduce speed limitations
- Compatible with one-sided M.2 NVMe SSDs (2280)
- Easy installation
TG Shield

Thermal Grizzly TG Shield is a high temperature conformal coating to protect components from liquid metal short circuits.
TG Remove

Thermal Grizzly TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. In addition TG Remove has a degreasing effect which helps preparing the surface for new application e. g. on CPUs.